Using Vertical Probe Cards is a convenient and economical way of testing electrical and mechanical components in an electronic system. With this method, you can detect the open and short circuits, measure the electrical characteristics of an LSI chip, and even detect high frequencies.
Cantilever Vertical probe cards restrict multi-DUT testing
Traditionally, cantilever probe cards are used for testing a single row peripheral multi-DUT. Today, new technologies enable the placement of significant test resources on the probe card. These new technologies help to overcome the limitations of cantilever probe cards and enhance performance, signal integrity and reliability.
One type of vertical probing technology consists of an array of pins. Another type uses lithographically defined contact bumps on a flexible membrane core. In either case, the conductive traces are typically copper.
The top-side metal support for a cantilever Vertical Probe Cards should be located as close to the array as possible. This is important for characterizing thermal expansion mismatches.
Problems with hot and cold temperature testing for KGD
Increasing demand for 5G technology means more complex testing and increased numbers of wafers to test. Manufacturers continue to innovate, as evidenced by the introduction of new probe tip materials and new probe card designs.
In order to improve testing efficiency, probe card manufacturers have developed solutions for testing at both high and low temperatures. This may involve modifying the construction of the probe card, shielding the card, or a combination of the two.
While these solutions may sound like a good idea, they are usually expensive and not always available. In some sectors, such as the automotive industry, extensive testing at high temperatures is a necessary evil.
Detect open and short circuits
During a wafer test, a probe card connects to metal pads on a semiconductor wafer and is used to perform electrical testing. It delivers relevant electrical parameters, such as input and output currents, temperature range, probe pitch, and more.
A typical probe card will test 16 times electrical connections. It may not always contact an active device. It is generally considered an expendable component. However, new IC technologies enable significant test resources to be placed on a probe card. This allows for loop back solutions and high-speed testing.
MEMS-based technologies are currently being developed for fine-pitch cantilever probe cards. They are designed for higher test speeds and greater test coverage.
Measure electric characteristics of an LSI chip
Currently, there is a need for a Vertical Probe Cards that can measure electric characteristics of an LSI chip. The invention described herein will help alleviate congestion in wiring patterns. The invention also demonstrates a method for fabricating a probe card.
To measure the electric characteristics of a semiconductor chip, a probe card needs to be able to contact the electrodes of the chip. This is a vital task for testing semiconductors at the wafer level. The present invention aims to provide a probe card that can accomplish this task with minimal effort.
The invention includes a probe card comprising a polyimide thin film (PIF) with bumps, a multi-layer wiring board (MBW), and a connector or electrode disposed on the peripheral region of the probe card. In addition, the invention includes the process of making the multi-layer wiring board. The multi-layer wiring board is manufactured by forming multiple wiring layers on a glass substrate.
Micro spring pins can support various attachment methods
Several attachment methods for vertical probe cards can be supported by micro spring pins. These include through hole mounting, wire termination, area array, flip chip, and more. Using spring-loaded pins allows the engineer to choose the right connector for their application. They are also highly reliable, durable, and compliant. This is important because they are used in a variety of demanding applications.
These pins are also referred to as Pogo Pins. Typically, they are machined from three different parts. They are then electro plated with gold over nickel. They are suitable for surface mount applications. They can be used in many different industries. These include electronics, semiconductor, and semiconductor test equipment. They are also highly reliable and have low resistance.
Detect electric current and high frequencies
Detect electric current and high frequencies with vertical probe cards. The use of contact probes to inspect electronic components is widely common. But the inspection accuracy can vary depending on the size of the probe, the shape of the contact pins, and the resistance of the leads. A contact probe usually consists of a first plunger and a coil spring. The contact parts are placed at both ends of the coil spring. Typical contact probes can withstand about one million contacts. The service life of a contact probe varies depending on the type of resistance, the temperature of the leads during inspection, and the environment in which it is used.
